The photovoltaic industry is always looking for ways to reduce the costs associated with solar cell production. Everyone's attention is drawn to the formulation of industry standards for manufacturing equipment and materials. This standard is specifically tailored to meet the needs of the photovoltaic industry, thereby reducing the complexity and cost of manufacturing ultra-high-purity semiconductors.
The world has been promoting the reduction of dependence on non-renewable energy, which has increased the demand for photovoltaic (PV) technology. However, the hope that solar energy has become a major source of renewable energy is constrained by the high cost of solar cell production. If the solar energy industry is to flourish, it must require a strong competitive advantage in terms of cost compared with traditional electricity, and it cannot rely on government subsidies forever. This means reducing the cost of solar energy production and realizing the cost of solar power generation is equal to the cost of conventional electricity generation.
One way to reduce costs is to match the criteria for component cleanliness and purity with the true process requirements for solar cell production. So far, the photovoltaic industry has always been based on the semiconductor industry, but in fact, ultra-high-purity semiconductor standards far exceed the standards required for solar cell manufacturing.
Solar cell manufacturers have recognized that the use of components that meet the ultra-high purity semiconductor process standards is too high in many cases. Due to the use of highly controllable production and cleaning protocols, which may well exceed the standards required for photovoltaic elements, the price rises in the production of ultra-high purity components. To date, substitutes for ultra-high-purity components have been "unqualified" products, and "unqualified" products have been defined in this article as products that meet non-ultra-high purity production and cleaning protocols. However, these "nonconforming" components are at risk, such as shutdown due to contamination and potential system integration issues.
The solution to this problem is to develop its own component process standards specifically for the photovoltaic industry. The first step for Swagelok to achieve this type of standard is the publication of a new "photovoltaic process specification" [1]. This specification meets the needs of the photovoltaic industry for the testing, cleaning and packaging steps of stainless steel components.
Photovoltaic Manufacturing Cleanliness The Swagelok Photovoltaic Process Specification establishes specific guidelines to support industry development to help drive market growth. The SEMI Photovoltaic Committee is also currently investigating and studying specifications that are directly related to the photovoltaic production market. Based on the company's cooperation with several photovoltaic product manufacturers, the Swagelok specification adopts strategies and processes for the cleanliness level of fluid system component manufacturing but does not overstep the needs of today's photovoltaic manufacturers. Compared to ultra-pure semiconductor systems, this specification helps reduce the overall cost of the photovoltaic system by reducing component fabrication steps.
The degree of component cleanliness is directly related to the process flow such as increasing the surface finish, removing metallic impurities, and minimizing the risk of corrosion and the generation of particles during use. In order to achieve a higher level of cleanliness, the component must go through many other manufacturing steps. For example, stainless steel may be reprocessed to reduce surface defects and reduce sulfur content, which also reduces potential metal contamination and corrosion.
In fluid systems for the fabrication of ultra-high-purity semiconductor wafers, components require a high level of process to minimize corrosion and particle generation. Small linewidths and high device densities create the need for ultra-high purity gas and chemical transport because carrying any particles downstream can contaminate the wafer, resulting in increased scrap rates and operating costs. Substrates used in solar cell production are less sensitive to particles, which is why ultra-high purity process standards are too stringent for photovoltaic manufacturing.
It is important for photovoltaic elements to follow proper cleaning standards. When a defective product is used in a corrosive photovoltaic manufacturing gas, it may cause corrosion and generate particles. Corrosion can sometimes lead to cross-contamination of gases, causing reactions in gas lines. Reactions of particles and gases delay or even block the pipeline, resulting in low deposition rates, reduced system availability, and production downtime.
A clean process environment is also critical to ensure proper adhesion between Thin Film Solar Cell (TFSC) layers, especially for the wiring process. The correct grade of PV elements provide an appropriate level of pollution control for reliable TFSC production.
A further consideration related to corrosion and cleanliness is safety. Some gases used in photovoltaic manufacturing are extremely reactive. If the component connections are corroded or damaged, these gases may leak unorganized into the air, creating a potentially hazardous work environment.
Photovoltaic Manufacturing Protocol The Swagelok Photovoltaic Process Specification is an overview of stainless steel component design, material selection, and manufacturing step protocols, similar to those used for ultra-high-purity semiconductor components (see Table 1), but is less stringent in some cases . For example, the requirements for surface finish are relaxed in the photovoltaic specification. Minimizing component surface defects and inclusions can reduce the overall area of ​​contact with the media, which increases purging and dewatering operations. These features are important for maintaining the cleanliness of semiconductor and photovoltaic processes. Photovoltaic production systems do not mind a small amount of contamination that may be caused by less polished surfaces.
Under this specification, the design advocates clean operations. The components must be easily cleaned and purged quickly, produce virtually no particles in the application, and maintain a minimum entrapment area. Good component design is very important in the production of TFSCs using continuous manufacturing processes. In such an environment, the equipment must be very reliable to avoid downtime of the entire production line. Therefore, the component cleaning specification must have considerable high reliability.
Material guidelines include chemical composition, material properties, inclusions, and other material characteristics to help ensure that the components are clean and leak-free.
According to the specification, manufacturing technology uses advanced tools, processing, polishing, and manufacturing methods to produce products with consistent surface finish with consistent reliability.
The most significant difference between ultra-high-purity semiconductors and photovoltaic component manufacturing protocols is in the final stages of the product's manufacturing cycle, including cleaning, calibration, and testing, as well as assembly and packaging. At these stages, the practices outlined in the Swagelok Photovoltaic Process Specification allow suppliers to reduce costs compared to manufacturing ultra-pure components. The saved costs are transferred to the supply chain, which helps to reduce the overall cost of solar power generation. In addition, the end user will realize the efficiency based on a less stringent packaging requirement during the installation process.
Every step in the clean production process can produce pollution. Therefore, ultra-high-purity semiconductor components must be thoroughly cleaned with organic solvents or alkaline or acidic cleaners after each step.
In the same way, photovoltaic elements must also be cleaned during the manufacturing process. However, the photovoltaic market agrees that ultra-pure semiconductor grade cleaning is not required for the two production methods most commonly used to produce solar cells, crystalline silicon (c-Si) or thin-film photovoltaic technology. The Swagelok PV process specification reduces the need for cell control (including resistivity and bacteria grade) compared to ultra-pure element cleaning standards.
The more relaxed cleaning specifications recommended for photovoltaic elements are related to the technologies used in solar cell production. Compared with semiconductor manufacturing, the requirements for pollution sensitivity of photovoltaic materials and line width are not so high. Instead of following today's stringent ultra-high purity standards, the Swagelok PV process specification aligns photovoltaic component cleaning methods with market demand for purity.
Verification and Testing Ultra High Purity and Photovoltaic Components A variety of tests are performed during the manufacturing process to confirm the cleanliness and quality of the product. Component manufacturers pay special attention to the verification of the corrosion resistance of chromium-rich oxide surfaces on stainless steel components. These surfaces enhance surface properties by removing surface iron and smoothing it during the manufacturing process through electropolishing and passivation processes.
Ultra-pure standards generally use advanced surface chemistry analysis techniques to confirm corrosion resistance. This technique analyzes a series of discrete points on the sample. Commonly used test methods include Auger Electron Spectroscopy (AES), Chemical Analysis with Electron Spectroscopy (ESCA), and Secondary Ion Mass Spectrometry (SIMS). These tests are often complex and often performed by third-party laboratories. These two factors result in increased costs for the manufacturing process of ultra-pure components.
Photovoltaic process specifications eliminate excessive costs by specifying alternative test methods (critical pitting temperature, CPT). The basis of the CPT test is ASTM G150 [2]. It determines the local pitting resistance by emphasizing the chrome oxide surface layer of the sample to reach the point of failure, thereby evaluating the entire passivated surface of the sample. The surface layer failure point temperature is CPT. Because the CPT test analyzes the entire area of ​​the sample that is in contact with the media, this method provides a better indication of how well an element withstands harsh environments than surface chemistry analysis techniques. In addition, CPT testing can provide more consistent results at a lower cost in less time, all of which make it the first choice for photovoltaic component testing.
Assembly and packaging must protect components from air contamination during assembly and packaging to help maintain their cleanliness. Ultrahigh purity specifications for semiconductor components require final assembly and packaging in a Class 100 clean room. This level of pollution protection is usually unnecessary for photovoltaic elements. Instead, PV process specifications require assembly and packaging in a controlled environment. In this environment, basic precautions are taken to prevent equipment from generating particles, air fibers, and common forms of contamination. Because it is not necessary to operate in a clean room, it can save extra time and expenses associated with it, and the supplier realizes that these saved costs will also benefit end customers.
The other saving is to reduce the number of packages. In order to meet the requirements of the semiconductor ultra-high purity specification, each component must be a double-layer package. The inner bag is packaged in a wear-resistant nylon material that is purged and filled with dry, filtered nitrogen. The sealed nylon bag is then heat sealed in an external polyethylene bag. According to the Swagelok Photovoltaic Process Specification, a single-layer, wear-resistant bag is sufficient to ensure that the product will not be exposed to external contamination during transport. This single-layer photovoltaic element bag will still be purged, but the reduction in packaging steps will save costs for both suppliers and end users.
When assembly and packaging requirements differ between ultra-pure semiconductors and photovoltaic elements, suppliers must comply with similar pollution protection protocols that apply to both types of products. No lubricant is used for the wetting area of ​​the component. The termination is wrapped to prevent contamination during transportation. Sealed packaging is individually packaged for shipping. In addition, product identification information and some traceable information can be seen without opening the product package.
Installation Because the installation is the last link between the manufacturing of components and the production of an operational system, the system assembler needs to maintain the original cleanliness of the fluid system components. The photovoltaic elements of a single bag should be carefully opened in a controlled environment to ensure that no particles are produced when opened. Using sharp knives instead of scissors helps to avoid particles. The connection should be properly aligned and assembled. Components with different purity and sulfur content cannot be mixed together. Authorized training provided by component suppliers is a valuable resource in an effective installation process.
The world has been promoting the reduction of dependence on non-renewable energy, which has increased the demand for photovoltaic (PV) technology. However, the hope that solar energy has become a major source of renewable energy is constrained by the high cost of solar cell production. If the solar energy industry is to flourish, it must require a strong competitive advantage in terms of cost compared with traditional electricity, and it cannot rely on government subsidies forever. This means reducing the cost of solar energy production and realizing the cost of solar power generation is equal to the cost of conventional electricity generation.
One way to reduce costs is to match the criteria for component cleanliness and purity with the true process requirements for solar cell production. So far, the photovoltaic industry has always been based on the semiconductor industry, but in fact, ultra-high-purity semiconductor standards far exceed the standards required for solar cell manufacturing.
Solar cell manufacturers have recognized that the use of components that meet the ultra-high purity semiconductor process standards is too high in many cases. Due to the use of highly controllable production and cleaning protocols, which may well exceed the standards required for photovoltaic elements, the price rises in the production of ultra-high purity components. To date, substitutes for ultra-high-purity components have been "unqualified" products, and "unqualified" products have been defined in this article as products that meet non-ultra-high purity production and cleaning protocols. However, these "nonconforming" components are at risk, such as shutdown due to contamination and potential system integration issues.
The solution to this problem is to develop its own component process standards specifically for the photovoltaic industry. The first step for Swagelok to achieve this type of standard is the publication of a new "photovoltaic process specification" [1]. This specification meets the needs of the photovoltaic industry for the testing, cleaning and packaging steps of stainless steel components.
Photovoltaic Manufacturing Cleanliness The Swagelok Photovoltaic Process Specification establishes specific guidelines to support industry development to help drive market growth. The SEMI Photovoltaic Committee is also currently investigating and studying specifications that are directly related to the photovoltaic production market. Based on the company's cooperation with several photovoltaic product manufacturers, the Swagelok specification adopts strategies and processes for the cleanliness level of fluid system component manufacturing but does not overstep the needs of today's photovoltaic manufacturers. Compared to ultra-pure semiconductor systems, this specification helps reduce the overall cost of the photovoltaic system by reducing component fabrication steps.
The degree of component cleanliness is directly related to the process flow such as increasing the surface finish, removing metallic impurities, and minimizing the risk of corrosion and the generation of particles during use. In order to achieve a higher level of cleanliness, the component must go through many other manufacturing steps. For example, stainless steel may be reprocessed to reduce surface defects and reduce sulfur content, which also reduces potential metal contamination and corrosion.
In fluid systems for the fabrication of ultra-high-purity semiconductor wafers, components require a high level of process to minimize corrosion and particle generation. Small linewidths and high device densities create the need for ultra-high purity gas and chemical transport because carrying any particles downstream can contaminate the wafer, resulting in increased scrap rates and operating costs. Substrates used in solar cell production are less sensitive to particles, which is why ultra-high purity process standards are too stringent for photovoltaic manufacturing.
It is important for photovoltaic elements to follow proper cleaning standards. When a defective product is used in a corrosive photovoltaic manufacturing gas, it may cause corrosion and generate particles. Corrosion can sometimes lead to cross-contamination of gases, causing reactions in gas lines. Reactions of particles and gases delay or even block the pipeline, resulting in low deposition rates, reduced system availability, and production downtime.
A clean process environment is also critical to ensure proper adhesion between Thin Film Solar Cell (TFSC) layers, especially for the wiring process. The correct grade of PV elements provide an appropriate level of pollution control for reliable TFSC production.
A further consideration related to corrosion and cleanliness is safety. Some gases used in photovoltaic manufacturing are extremely reactive. If the component connections are corroded or damaged, these gases may leak unorganized into the air, creating a potentially hazardous work environment.
Photovoltaic Manufacturing Protocol The Swagelok Photovoltaic Process Specification is an overview of stainless steel component design, material selection, and manufacturing step protocols, similar to those used for ultra-high-purity semiconductor components (see Table 1), but is less stringent in some cases . For example, the requirements for surface finish are relaxed in the photovoltaic specification. Minimizing component surface defects and inclusions can reduce the overall area of ​​contact with the media, which increases purging and dewatering operations. These features are important for maintaining the cleanliness of semiconductor and photovoltaic processes. Photovoltaic production systems do not mind a small amount of contamination that may be caused by less polished surfaces.
Under this specification, the design advocates clean operations. The components must be easily cleaned and purged quickly, produce virtually no particles in the application, and maintain a minimum entrapment area. Good component design is very important in the production of TFSCs using continuous manufacturing processes. In such an environment, the equipment must be very reliable to avoid downtime of the entire production line. Therefore, the component cleaning specification must have considerable high reliability.
Material guidelines include chemical composition, material properties, inclusions, and other material characteristics to help ensure that the components are clean and leak-free.
According to the specification, manufacturing technology uses advanced tools, processing, polishing, and manufacturing methods to produce products with consistent surface finish with consistent reliability.
The most significant difference between ultra-high-purity semiconductors and photovoltaic component manufacturing protocols is in the final stages of the product's manufacturing cycle, including cleaning, calibration, and testing, as well as assembly and packaging. At these stages, the practices outlined in the Swagelok Photovoltaic Process Specification allow suppliers to reduce costs compared to manufacturing ultra-pure components. The saved costs are transferred to the supply chain, which helps to reduce the overall cost of solar power generation. In addition, the end user will realize the efficiency based on a less stringent packaging requirement during the installation process.
Every step in the clean production process can produce pollution. Therefore, ultra-high-purity semiconductor components must be thoroughly cleaned with organic solvents or alkaline or acidic cleaners after each step.
In the same way, photovoltaic elements must also be cleaned during the manufacturing process. However, the photovoltaic market agrees that ultra-pure semiconductor grade cleaning is not required for the two production methods most commonly used to produce solar cells, crystalline silicon (c-Si) or thin-film photovoltaic technology. The Swagelok PV process specification reduces the need for cell control (including resistivity and bacteria grade) compared to ultra-pure element cleaning standards.
The more relaxed cleaning specifications recommended for photovoltaic elements are related to the technologies used in solar cell production. Compared with semiconductor manufacturing, the requirements for pollution sensitivity of photovoltaic materials and line width are not so high. Instead of following today's stringent ultra-high purity standards, the Swagelok PV process specification aligns photovoltaic component cleaning methods with market demand for purity.
Verification and Testing Ultra High Purity and Photovoltaic Components A variety of tests are performed during the manufacturing process to confirm the cleanliness and quality of the product. Component manufacturers pay special attention to the verification of the corrosion resistance of chromium-rich oxide surfaces on stainless steel components. These surfaces enhance surface properties by removing surface iron and smoothing it during the manufacturing process through electropolishing and passivation processes.
Ultra-pure standards generally use advanced surface chemistry analysis techniques to confirm corrosion resistance. This technique analyzes a series of discrete points on the sample. Commonly used test methods include Auger Electron Spectroscopy (AES), Chemical Analysis with Electron Spectroscopy (ESCA), and Secondary Ion Mass Spectrometry (SIMS). These tests are often complex and often performed by third-party laboratories. These two factors result in increased costs for the manufacturing process of ultra-pure components.
Photovoltaic process specifications eliminate excessive costs by specifying alternative test methods (critical pitting temperature, CPT). The basis of the CPT test is ASTM G150 [2]. It determines the local pitting resistance by emphasizing the chrome oxide surface layer of the sample to reach the point of failure, thereby evaluating the entire passivated surface of the sample. The surface layer failure point temperature is CPT. Because the CPT test analyzes the entire area of ​​the sample that is in contact with the media, this method provides a better indication of how well an element withstands harsh environments than surface chemistry analysis techniques. In addition, CPT testing can provide more consistent results at a lower cost in less time, all of which make it the first choice for photovoltaic component testing.
Assembly and packaging must protect components from air contamination during assembly and packaging to help maintain their cleanliness. Ultrahigh purity specifications for semiconductor components require final assembly and packaging in a Class 100 clean room. This level of pollution protection is usually unnecessary for photovoltaic elements. Instead, PV process specifications require assembly and packaging in a controlled environment. In this environment, basic precautions are taken to prevent equipment from generating particles, air fibers, and common forms of contamination. Because it is not necessary to operate in a clean room, it can save extra time and expenses associated with it, and the supplier realizes that these saved costs will also benefit end customers.
The other saving is to reduce the number of packages. In order to meet the requirements of the semiconductor ultra-high purity specification, each component must be a double-layer package. The inner bag is packaged in a wear-resistant nylon material that is purged and filled with dry, filtered nitrogen. The sealed nylon bag is then heat sealed in an external polyethylene bag. According to the Swagelok Photovoltaic Process Specification, a single-layer, wear-resistant bag is sufficient to ensure that the product will not be exposed to external contamination during transport. This single-layer photovoltaic element bag will still be purged, but the reduction in packaging steps will save costs for both suppliers and end users.
When assembly and packaging requirements differ between ultra-pure semiconductors and photovoltaic elements, suppliers must comply with similar pollution protection protocols that apply to both types of products. No lubricant is used for the wetting area of ​​the component. The termination is wrapped to prevent contamination during transportation. Sealed packaging is individually packaged for shipping. In addition, product identification information and some traceable information can be seen without opening the product package.
Installation Because the installation is the last link between the manufacturing of components and the production of an operational system, the system assembler needs to maintain the original cleanliness of the fluid system components. The photovoltaic elements of a single bag should be carefully opened in a controlled environment to ensure that no particles are produced when opened. Using sharp knives instead of scissors helps to avoid particles. The connection should be properly aligned and assembled. Components with different purity and sulfur content cannot be mixed together. Authorized training provided by component suppliers is a valuable resource in an effective installation process.
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