LED Chip Manufacturing Equipment and Its Process Introduction

Release date: 2017-11-01 Source: Foreign station Sharing:

LED is a technology-driven industry, especially in the chip manufacturing sector, which is both technology and capital-intensive. It relies heavily on advanced process equipment to support production. However, similar to the "bottleneck" seen during the semiconductor investment boom, there is still a mismatch between equipment R&D and industrial expansion. In particular, high-end equipment remains largely dependent on imports. The high cost of imported machines and long procurement cycles have created an urgent need for the development of domestic LED chip manufacturing equipment.

The upstream epitaxial wafer growth is a critical part of the LED industry chain, along with midstream chip manufacturing and downstream packaging and application. As we move from upstream to downstream, the barriers to entry gradually decrease. Among these, epitaxial growth is the most technically challenging and capital-intensive segment, facing intense international competition and high risk. Approximately 70% of the industry's profits come from epitaxial growth and chip manufacturing, while packaging and applications account for about 10-20% each.

The equipment used across the entire supply chain follows the same pattern—higher technology and higher investment. In China, more than 60 companies involved in epitaxial wafer growth and midstream chip manufacturing rely mostly on imported core equipment. This dependency limits technological development and makes it difficult to match global standards. As a result, China's capacity to produce high-end epitaxial wafers and chips remains insufficient, leading to heavy reliance on imports and hindering the growth and profitability of the domestic LED industry.

Table 1 provides an overview of the LED industry chain and key equipment:

• Upstream: Single crystal rod, single wafer, PSS, epitaxial wafer – MOCVD, ICP etching machine, lithography machine, PECVD.
• Midstream: Metal evaporation, lithography, electrode fabrication, chip cutting, test sorting – ICP etching machine, lithography machine, evaporation table, sputtering table, laser dicing machine.
• Downstream: Solid crystal (chip bonding), wire bonding, resin packaging, cutting angle – solid crystal machines, wire bonding machines, etc.

Epitaxial growth is the core of LED production because it determines the performance and quality of the final light source. MOCVD has become one of the most popular and technically demanding equipment due to its complexity and high cost, which is dominated by foreign manufacturers. Therefore, the localization of MOCVD equipment is highly anticipated in the domestic market. Some Chinese companies and research institutions have begun developing MOCVD systems, but commercial applications are still in the early stages.

With continuous innovation in epitaxial technology, especially the widespread use of sapphire substrates (PSS), sapphire etching equipment has become a key component in LED production. Its process capabilities significantly affect film-forming performance, drawing increasing attention from the industry. Northern Microelectronics, a rising star in the domestic semiconductor equipment sector, has developed the ELEDETM 330 ICP etching machine. Leveraging its expertise in high-end semiconductor and solar equipment, this machine has been successfully applied in large-scale production lines, marking a breakthrough in the localization of LED production equipment.

In midstream chip manufacturing, the main equipment includes etching machines, lithography machines, evaporation tables, sputtering tables, and laser dicing machines. These tools are essential for designing device structures and processes based on LED performance requirements.

1. Etching Process and Equipment: Etching plays a crucial role in midstream chip manufacturing. With the growing adoption of patterned substrates, the demand for ICP etching machines has increased significantly. These machines must handle high batch capacities, ensure uniformity, and offer automated operation. Northern Microelectronics’ ELEDETM 330 etching machine integrates advanced technologies to meet the rigorous demands of large-scale LED production.

2. Lithography Process and Equipment: Photolithography is used to create patterns on wafers for etching and electrode fabrication. Contact lithography is currently the mainstream due to its low cost, but projection lithography is becoming more common as PSS substrates and smaller features become standard. Nanoimprinting, although promising, is still in the research phase due to issues with repeatability.

Domestic contact lithography machines are mainly imported, while projection lithography machines often use refurbished semiconductor equipment. Despite these challenges, the potential for developing domestic LED lithography equipment is strong, given the accumulated experience and technical foundation in the field.

As the LED industry continues to evolve, the need for localized, high-quality manufacturing equipment becomes increasingly important. Domestic companies are making progress, but further investment and innovation are needed to achieve full self-reliance in the supply chain.

Label: LED Chip Manufacturing Equipment and Its Process Introduction

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