It is reported that the semiconductor project jointly established by Taiwan Lisheng Investment Holding Group and Hong Kong enterprises has signed up to settle in Nanjing, with a total planned investment of 1.2 billion US dollars.
The project is located in Nanjing Economic and Technological Development Zone. It is jointly established by Taiwan Lisheng Investment Holding Group, Hong Kong Guangtian Investment Group and Taiwan-Hong Kong related investors. It introduces 200 to 300 industry experts at home and abroad to build compound semiconductor R&D, packaging and testing. , industry-university research, incubation and global compound semiconductor technology exchange base.
The project plans to invest USD 1.2 billion, and the first phase plans to invest USD 300 million to build R&D, packaging, testing, production, research and development and company operation headquarters of GaAs and GaN compound semiconductor products. After the project is completed, it can realize annual sales of 20 billion. Yuan Renminbi. The second phase of the project is planned to develop, produce and sell GaN, silicon carbide semiconductor epitaxial wafers and chips.
The project is located in Nanjing Economic and Technological Development Zone. It is jointly established by Taiwan Lisheng Investment Holding Group, Hong Kong Guangtian Investment Group and Taiwan-Hong Kong related investors. It introduces 200 to 300 industry experts at home and abroad to build compound semiconductor R&D, packaging and testing. , industry-university research, incubation and global compound semiconductor technology exchange base.
The project plans to invest USD 1.2 billion, and the first phase plans to invest USD 300 million to build R&D, packaging, testing, production, research and development and company operation headquarters of GaAs and GaN compound semiconductor products. After the project is completed, it can realize annual sales of 20 billion. Yuan Renminbi. The second phase of the project is planned to develop, produce and sell GaN, silicon carbide semiconductor epitaxial wafers and chips.
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