Jingke high-power flip-chip LED chip has a new high brightness

On February 21st, according to the relevant person in charge of Jingke Electronics (Guangzhou) Co., Ltd., the company used flip-chip welding technology with independent intellectual property rights to produce high-power module chips (four 1W chips flip-chip), chips The size is only 3.36x3.36mm2, and it has recently reached a new high in brightness history. The module chip is tested at a voltage of 6.6V and a current of 700mA. The luminous flux of the white light package reaches 422.4lm, and the luminous efficiency reaches 91.4lm/W. Now Jingke Electronics has started mass production of this high-brightness module chip and has been promoted to the market. It has been widely praised by many customers, making the LED lighting popularization business a big step forward, and at the same time making domestic chip technology reach the international leading position. Level.



    The module chip developed by Jingke Electronics adopts flip-chip bonding technology. As shown in Figure C above, it realizes gold-free interconnection with respect to LEDs with formal structure or vertical structure, and has high yield and high reliability. Good, strong heat dissipation, built-in ESD protection circuit to resist static electricity up to 6000V (HBM), is the best choice for ultra-high power chip light source.

 

Flip-chip high power module chip physical map

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