The Power TOPLED SFH4250S from OSRAM Opto Semiconductors emits almost twice as much infrared light as the SFH4250 standard components. With continuous operation at 70 mA drive current, this new infrared LED has a typical radiant intensity of 22 mW/sr and a total radiant flux of 70 mW. The high brightness of the component enables it to achieve a high-compact lighting design that also greatly enhances the effective range of existing designs. Among the many beneficial applications, 3D TV is one of them.
Osram Opto Semiconductors has been able to achieve significant performance improvements this time thanks to her thin film chip stacking technology. As early as last year, this stacking technology was introduced into the assembly of 1 mm2 large chips, successfully upgrading from a PN junction to a serial connection of two PN junctions, and doubling performance. This unique technology is also used in the SFH4250S chip with a side length of 300 μm. Harald Feltges, Marketing Manager, Infrared Components Division, Osram Opto Semiconductors, Germany, stated: "This new product is the industry's recognized combination of chip design and standard packaging, further expanding our powerful IR emitter portfolio, allowing our customers to Direct use, no need to change existing designs.†The new stacked Power TOPLED can be pulsed at pulse currents up to 1 A, with a radiation intensity of 220 mW/sr and a total radiant flux of 700 mW.
In addition, this new component is the ideal choice for applications that require infrared light to illuminate large areas on compact lighting fixtures. A typical example of this is the 3D TV: the powerful infrared emitters illuminate the area within 7 meters of the TV, so the shutter mirror and TV picture can be synchronized. Feltges said: "With the new stacked Power TOPLED, the number of infrared LEDs required per TV will be reduced by nearly half. On the other hand, it can also expand the effective range of existing designs."
The SFH4250S has an emission wavelength of 850 nm, so the naked eye cannot see the light it emits, nor does it interfere with the remote control operating at about 950 nm. Many computer games also use 3D technology and will benefit from these new infrared emitters. In addition, due to the increase of infrared power, it is also very helpful for the vehicle safety system, especially the seat occupancy detection system for airbag activation and the driver status monitoring system (driver sleepiness detection system) for enabling fatigue monitoring. .
Thin film chip stacking technology has been tested and tested in a number of applications, including night vision systems in vehicles and sensors in mobile end user devices; the latter benefit in particular from the superior efficiency of stacked chips. By extending the stacking technology to the Power TOPLED product line, OSRAM Opto Semiconductors has further strengthened its leading position in the field of high-power infrared emitters. The new Power TOPLED SFH 4250S is available now.
Thanks to the high-efficiency stacking technology of the thin-film chip, the infrared power TOPLED SFH4250S emits almost twice as much infrared light as a standard device, thus greatly expanding the effective range of 3D TVs and the like.
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