Dialog Expands Its Bluetooth Smart SoC Portfolio for IoT Applications

Beijing, China, March 25, 2015 – Dialog Semiconductor, Inc. (Frankfurt Stock Exchange: DLG), a provider of highly integrated power management, AC/DC power conversion, solid state lighting (SSL) and smart Bluetooth wireless technology, announced today that it has The ultra-low-power smart Bluetooth SoC series that has been successful in the market has added three new products, the DA14581, DA14582 and DA14583, which are currently the smallest in wireless charging and remote control (RCU) applications for the Internet of Things (IoT). The lowest-power wireless connectivity solution with a high-volume, high-growth application market.

Sean McGrath, senior vice president and general manager of the Interconnect, Automotive and Industrial business at Dialog Semiconductor, said: "Our first SmartBond device, the DA14580, is based on its ultra-small size and ultra-low power consumption in human interface devices (HID). Applications such as proximity sensing, medical electronics and smart home have been successful and have helped us gain market leadership. We have reason to believe that the successor models of the DA14580 will continue to help customers achieve their design goals quickly and reliably and continue to be sought after by the market. ""

DA14581

He also pointed out: "In the wireless charging and RCU market, Bluetooth low energy is the ideal protocol for control and communication because it is on smartphones, tablets, smart TVs and many other consumer devices. The application is very common. As our SmartBond product line expands, we will continue to help customers more easily integrate these ultra-low-power, fully-hosted Bluetooth solutions, enabling their products to provide consumers with unparalleled batteries. Life time."

The DA14581 is optimized for loosely coupled, highly resonant inductive charging based on the A4WP standard. To ensure reliable charging under all conditions including battery failure, the DA14581 can be started in 50 milliseconds when used in a powered unit. When used in a power transmission unit, the optimized device can track and control the charging process of 8 devices simultaneously. Code optimized for HCI (used to provide standardized communication between the host stack and the controller) can now be programmed into one-time programmable (OTP) memory, allowing users to develop external microcontrollers and third-party stacks (third- Party stack) A pre-programmed HCI product for use together. According to market analysis firm Darnell, sales of wireless charging receivers and transmitter chips will reach $2.8 billion by 2020.

Optimized for use with speech recognition and motion and gesture recognition technology to control the next generation of smart TVs and set-top box RCUs, the DA14582 integrates an analog audio codec with native support for the microphone. As set-top boxes and smart TVs begin to have built-in Wi-Fi and Bluetooth Smart capabilities, Bluetooth Smart is replacing Bluetooth Classic in remote controls due to lower power consumption and shorter connection delays.

The third new device, the DA14583, is a SmartBond SoC with 1 Mbit (128 kByte) flash. This is the flash version of the DA14580, enabling customers to upgrade their products to the latest through wireless (OTA) software. The device is pin compatible with the DA14580 OTP version. This allows design engineers to save money when transitioning from a flash version to an OTP version after their application is mature, especially when they need an OTA upgrade in the early stages of development and production.

The SmartBond SoC integrates the ARM® CortexTM-M0 low-power Bluetooth radio receiver with application processor and intelligent power management. Building a complete Bluetooth Smart solution requires only five peripheral components that provide unparalleled system integration and the world's lowest power consumption. The device's ARM Cortex M0 processor and a full suite of digital and analog peripherals are accessible through up to 32 GPIOs, making it ideal for all Bluetooth Smart applications. Since launching the DA14580 with the best power performance on the market in January 2014, all of Dialog's products have achieved a 20% reduction in power consumption.

The SmartBond Development Kit comes with a power profiler to support power-optimized programming and Dialog's SmartSnippetsTM software development environment based on the KeilTM-based μVision tool. The toolkit also includes sample application code for embedded and hosted models to help speed product development.

About Dialog Semiconductor

Dialog Semiconductor offers highly integrated standard (ASSP) and custom (ASIC) mixed-signal integrated circuits (ICs) for smartphones, tablets, IoT, solid-state lighting (SSL) and smart appliance applications. With decades of experience, Dialog is able to rapidly develop a wide range of ICs, providing business partners with flexible and dynamic support, world-class innovation and security services. Dialog works with world-class manufacturers to adopt a fabless business operation model. As an employer, Dialog actively assumes social responsibility and carries out activities to benefit employees, communities, other stakeholders and our natural environment.

Dialog Semiconductor's DC-DC configurable system power management and other energy-saving technologies enhance efficiency and enhance the consumer's user experience by extending battery life and enabling fast charging of portable devices. The company's technology portfolio also includes audio, smart Bluetooth® Smart®, fast charging Rapid ChargeTM AC/DC power conversion and multi-touch technology.

Headquartered in London, Dialog Semiconductor has sales, R&D and marketing facilities worldwide. In 2014, Dialog achieved revenue of approximately $1.16 billion and is one of the fastest growing listed semiconductor companies in Europe. Currently, the company has 1,400 employees worldwide. Dialog is listed on the Frankfurt (FWB: DLG) stock exchange (Regulated Market, Prime Standard, ISIN GB0059822006) and its stock is a constituent of the German TecDax Technology Stock Index. At the same time, the company's convertible bonds are listed on the Euro MTF Market of the Luxembourg Stock Exchange (ISIN XS0757015606).

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